Features

Glass passivated chip .

1000 W peak pulse power capability with a 10/1000 us waveform .

Repetitive rate (duty cycle):0.01 % .

Very Fast response time: typically less than 1.0ps from 0V to VBR min

Excellent clamping capability .

For surface mounted applications in order to optimize board space .

High temperature soldering: 260℃/10s at terminals .

Plastic package has Underwriters Laboratory Flammability 94V-0 .

Halogen free and RoHS compliant .