FEATURES

• For surface mounted applications in order to

optimize board space

• Glass passivated junction

• Built-in strain relief

• Excellent clamping capability

• Low profile package

• Low inductance

• Excellent clamping capability

• Fast response time: typically less than

1.0 ps from 0 volts to BV min

• Typical IR less than 1μA above 10V

• High temperature soldering guaranteed:

250°C/10 seconds at terminals