Surface Mount Ultrafast Rectifier

FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Compliant to RoHS directive 2002/95/EC and in acc

Surface Mount Ultrafast Rectifier

FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified • Material categorization: For definitions of compliance please see

Surface-Mount Ultrafast Rectifier

Low profile package\nIdeal for automated placement\nOxide planar chip junction;

Surface Mount Ultrafast Rectifier

文件：109.07 Kbytes Page：5 Pages

Surface Mount Ultrafast Rectifier

FEATURES • Low profile package • Ideal for automated placement • Oxide planar chip junction • Ultrafast recovery times for high frequency • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified • Material categorization: For definitions of compliance please see

Surface Mount Ultrafast Rectifier

文件：109.07 Kbytes Page：5 Pages

Surface-Mount Ultrafast Rectifier

文件：103.68 Kbytes Page：5 Pages

封装/外壳：DO-214AB，SMC 包装：卷带（TR） 描述：DIODE GEN PURP 100V 3A DO214AB 分立半导体产品 二极管 - 整流器 - 单

DIODE GEN PURP 100V 3A DO214AB

封装/外壳：DO-214AB，SMC 包装：卷带（TR） 描述：DIODE GEN PURP 100V 3A DO214AB 分立半导体产品 二极管 - 整流器 - 单

Oxide planar chip junction

文件：89.24 Kbytes Page：4 Pages

Oxide planar chip junction