ULTRA FAST RECOVERY MODULES

Ultrafast Recovery Modules ● Ultra Fast Recovery ● 175°C Junction Temperature ● VRRM 100 to 800 Volts ● Electrically isolated base ● 2 X 70 Amp current rating ● ROHS Compliant

封装/外壳：TO-249AA 隔离式底座 包装：卷带（TR） 描述：DIODE MODULE 600V 70A TO249 分立半导体产品 二极管 - 整流器 - 阵列

Dual Common Cathode

Dual Common Anode

Ultrafast Recovery Modules

文件：218.72 Kbytes Page：4 Pages

Ultrafast Recovery Modules

文件：218.72 Kbytes Page：4 Pages

封装/外壳：TO-249AA 隔离式底座 包装：散装 描述：DIODE MODULE 600V 70A TO249 分立半导体产品 二极管 - 整流器 - 阵列

Phase Leg

Breake Away Header .025(0.64mm) Square Posts

[FOXCONN] Breake Away Header .025 (0.64mm) Square Posts

Breake Away Header .025(0.64mm) Square Posts

[FOXCONN] Breake Away Header .025 (0.64mm) Square Posts

CL-GD5434 V1.00 Software Release Errata

FEATURES • Pin- and software-compatible VGA graphics accelerator family • Enhanced GUI acceleration - 64-bit Bit Block Transfer (BitBLT) engine (CL-GD5434) - 32-bit BitBLT engine (CL-GD5430) • 32-bit direct-connect CPU interface - PCITM bus (v2.0 compliant) with burst-cycle support - VESA®

Common Mode Inductors

文件：29.56 Kbytes Page：1 Pages