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OB1-LF中文资料
OB1-LF数据手册规格书PDF详情
FEATURES:
• Solderless, 5-holes per pad, & 0.1 x 0.1 grid of holes
• Plated holes: 0.037 diameter
• Lead-free PCB with gold plating; 0.062 thick
• 3mm screw/nut included to secure module to board (additional soldering required)
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OB1-LF 芯片相关型号
- GS12-10
- GS12-120
- GS12-150
- GS12L-300
- GS12L-95
- IS61VVF102418B
- IS61VVF102436B-7.5B2
- IS61VVF102436B-7.5B2I
- IS61VVF102436B-7.5B2L
- IS61VVF102436B-7.5B2LI
- IS61VVF102436B-7.5B3
- IS61VVF102436B-7.5B3I
- IS61VVF102436B-7.5B3L
- IS61VVF102436B-7.5B3LI
- IS61VVF102436B-7.5TQI
- IS61VVF102436B-7.5TQL
- IS61VVF102436B-7.5TQLI
- TLV70218DBVR.A
- TLV70218DBVR.B
- TLV70218DBVRG4
- TLV70218DBVRG4.A
- TLV70218DBVRG4.B
- TLV70218DBVT
- TLV70218DBVT.A
- TLV70218DBVT.B
- TLV803SDBZR
- TLV803SDBZR.A
- TLV803SDBZRG4
- TMS320F2812PGFQ
- TMS320F2812PGFQ.A
Datasheet数据表PDF页码索引
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