FEATURES

- Glass passivated junction chip

- Ideal for automated placement

- Low profile package

- Built-in strain rellef

- Super fast recovery time for high efficiency

- Moisture sensitivity level: level 1, per J-STD-020

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

- Halogen-free according to IEC 61249-2-21 definition

MECHANICAL DATA

Case: DO-214AC (SMA)

Molding compound, UL flammability classification rating 94V-0

Base P/N with suffix G on packing code - Green compound (halogen-free)

Base P/N with prefix H on packing code - AEC-Q101 qualified

Terminal: Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

with prefix H on packing code meet JESD 201 class 2 whisker test

Polarity: Indicated by cathode band

Weight: 0.06 g (approximately)