FEATURES

- Glass passivated junction chip

- Ideal for automated placement

- Low profile package

- Low power loss, high efficiency

- Halogen-free according to IEC 61249-2-21

- Compliant to RoHS Directive 2011/65/EU and

in accordance to WEEE 2002/96/EC

MECHANICALW DATA

Case: SOD-123FL

Molding compound, UL flammability classification rating 94V-0

Moisture sensitivity level: level 1, per J-STD-020

Packing code with suffix G means green compound (halogen-free)

Terminal: Matte tin plated leads, solderable per JESD22-B102

Meet JESD 201 class 1A whisker test

Polarity: Indicated by cathode band

Weight: 0.016 g (approximately)