Product Description

The TGA2925-SG HPA provides 11 •B of gain, 5.6 W of output power at 3.5 GHz and 2.5 EVM at 29 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.16 and WiMax. The package has a high thermal conductivity copper alloy base. Internal partial matching simplifies system board layout by requiring a minimum of external components.

Key Features

• 3.5 GHz Application Frequency Range

• 11 dB Nominal Gain

• 2.5EVM @29dBm OFDM signal at 3.5GHz

• 37.5 dBm Nominal Psat

• Internally Partially Matched

• IMD3 -50 dBc @ 24 dBm SCL, Typical

• Bias Conditions: 8 V @ 0.75 A (Quiescent)

• 0.5 µm HFET Technology

• 2 lead Cu-alloy base package

Primary Applications

• 802.16 and WiMax

• S-Band Power Amplifiers