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TMP103BYFFR.B中文资料

厂家型号

TMP103BYFFR.B

文件大小

559.37Kbytes

页面数量

30

功能描述

TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP

数据手册

下载地址一下载地址二到原厂下载

生产厂商

TI2

TMP103BYFFR.B数据手册规格书PDF详情

1 Features

1• Multiple Device Access (MDA):

– Global Read/Write Operations

• I2C™ and SMBus™-Compatible Interface

• Resolution: 8 Bits

• Accuracy: ±1°C Typical (–10°C to 100°C)

• Low Quiescent Current:

– 3-μA Active IQ at 0.25 Hz

– 1-μA Shutdown

• Supply Range: 1.4 V to 3.6 V

• Digital Output

• 4-Ball WCSP (DSBGA) Package

2 Applications

• Handsets

• Notebooks

• SSDs

• Servers

• Telecom

• Set Top Boxes

• Low Power Environmental

• Sensors

3 Description

The TMP103 is a digital output temperature sensor in

a four-ball wafer chip-scale package (WCSP). The

TMP103 is capable of reading temperatures to a

resolution of 1°C.

The TMP103 features a two-wire interface that is

compatible with both I2C and SMBus interfaces. In

addition, the interface supports multiple device

access (MDA) commands that allow the master to

communicate with multiple devices on the bus

simultaneously, eliminating the need to send

individual commands to each TMP103 on the bus.

Up to eight TMP103s can be tied together in parallel

and easily read by the host. The TMP103 is

especially suitable for space-constrained, powersensitive

applications with multiple temperature

measurement zones that must be monitored.

The TMP103 is specified for operation over a

temperature range of –40°C to 125°C.

更新时间:2025-11-22 15:01:00
供应商 型号 品牌 批号 封装 库存 备注 价格
TI
25+
DSBGA4
4154
TI
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DSBGA4
8000
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TI/德州仪器
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DSBGA4
10000
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24+
DSBGA4
9937
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23+
DSBGA4
5000
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DSBGA4
3200
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TI
25+
DSBGA4
3200
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TI
2511
DSBGA4
3200
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