State-of-the-Art Advanced BiCMOS

Technology (ABT) Design for 3.3-V

Operation and Low Static Power

Dissipation

Support Mixed-Mode Signal Operation (5-V

Input and Output Voltages With 3.3-V VCC)

Support Unregulated Battery Operation

Down to 2.7 V

Typical VOLP (Output Ground Bounce)

< 0.8 V at VCC = 3.3 V, TA = 25°C

ESD Protection Exceeds 2000 V Per

MIL-STD-883C, Method 3015; Exceeds

200 V Using Machine Model

(C = 200 pF, R = 0)

Latch-Up Performance Exceeds 500 mA

Per JEDEC Standard JESD-17

Bus-Hold Data Inputs Eliminate the Need

for External Pullup Resistors

Support Live Insertion

Package Options Include Plastic

Small-Outline (DW), Shrink Small-Outline

(DB), and Thin Shrink Small-Outline (PW)

Packages, Ceramic Chip Carriers (FK),

Ceramic Flat (W) Packages, and Ceramic

(J) DIPs

description

These octal flip-flops are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to

provide a TTL interface to a 5-V system environment.

The eight flip-flops of the ′LVT574 are edge-triggered D-type flip-flops. On the positive transition of the clock

(CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high

or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive

the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus

lines without need for interface or pullup components. OE does not affect the internal operations of the flip-flops.

Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74LVT574 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count

and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVT574 is characterized for operation over the full military temperature range of −55°C to 125°C. The

SN74LVT574 is characterized for operation from −40°C to 85°C.