1 Features

• 3 Buck converters at up to 2.3-MHz non-fixed

switching frequency:

– 1x VIN: 2.5 V – 5.5 V; IOUT: 3.5 A; VOUT 0.6 V –

3.4 V

– 2x VIN: 2.5 V – 5.5 V; IOUT: 2 A; VOUT 0.6 V –

3.4 V

• 4 linear regulators:

– 2x VIN: 1.5 V – 5.5 V; IOUT: 400 mA; VOUT:

0.6 V – 3.4 V (configurable as load switch and

bypass-mode, supporting SD-Card)

– 2x VIN: 2.2 V – 5.5 V; IOUT: 300 mA; VOUT: 1.2

V – 3.3 V (configurable as load switch)

• Dynamic voltage scaling on all three buck

converters

• Low IQ/PFM, PWM-mode (quasi-fixed frequency)

• Programmable power sequencing and default

voltages

• I2C interface, supporting standard, fast-mode and

fast-mode+

• Designed to support systems with up to 14+

rails (2x TPS65219 7 rails each + GPO-controlled

external rails)

• 2 GPOs, 1 GPIO, and 3 multi-function-pins

• EEPROM programmability

2 Applications

• Low power industrial MPUs for example: AM62x,

AM64x

• HMI

• PLC

• Industrial PC

• Building security

• HVAC

• Video surveillance

• Data concentrators

• Smart meter

• Protection relays

• Patient monitoring and diagnostics

• Imaging

3 Description

The TPS65219 is a Power Management IC (PMIC)

designed to supply a wide range of SoCs in both

portable and stationary applications. The device is

characterized across an ambient temperature range

of –40°C to +105°C, making it suitable for various

industrial applications. The device includes three

synchronous stepdown DC-DC converters and four

linear regulators.

The DC-DC converters are capable of 1x 3.5 A and

2x 2 A. They require a small 470 nH inductor, 4.7 μF

input capacitance, and - depending on configuration -

minimum 30 μF output capacitance per rail.

Two of the LDOs support output currents of 400

mA at an output voltage range of 0.6 V to 3.4 V.

These LDOs support bypass mode, acting as a loadswitch,

and allow voltage-changes during operation.

The other two LDOs support output currents of 300

mA at an output voltage range of 1.2 V to 3.3 V. They

also support load-switch mode.

The I2C-interface, IOs, GPIOs and multi-function-pins

(MFP) allow a seamless interface to a wide range of

SoCs.