1 Features

• AEC-Q100 qualified for automotive applications

– Temperature grade 1: –40°C to 125°C

– Device HBM ESD classification level 2

– Device CDM ESD classification level C5

– Withstands 35-V load dump

• Functional Safety-Compliant Development

– Documentation on safety mechanisms will be

available at product release to aid ISO 26262

system design up to ASIL-B

• Dual-channel SPI controlled smart high-side switch

with a typical 11-mΩ Rdson at 25°C FET

• Integrated wire-harness protection without MCU

involvement and a SPI programmable fuse curve

– Protection against persistent overload condition

• Improve system level reliability through SPI

programmable adjustable overcurrent protection

– Overcurrent protection threshold: 10 to 70 A

• SPI configurable capacitive charging mode to drive

a wide range of capacitive input ECUs load current

needs.

• Low quiescent current, low power ON-state to

supply always-ON loads with automatic wake on

load current increase with wake signal to MCU

• Robust integrated output protection:

– Integrated thermal protection

– Protection against short-to-ground

– Protection against reverse battery events

including automatic switch on of FET with

reverse supply voltage

– Automatic shut off on loss of battery and

ground

– Integrated output clamp to demagnetize

inductive loads

• Digital sense output via SPI can be configured to

measure:

– Load current accurately with integrated ADC

– Output or supply voltage, FET temperature

• Provides full fault diagnostics through SPI interface

and indication through FLT pin

– Detection of open load and short-to-battery

2 Applications

• Automotive zone ECU

• Power distribution modules

• Body control modules

3 Description

The TPS2HCS10-Q1 device is a dual channel,

smart high-side switch controlled through a serial

peripheral interface (SPI). The device integrates

robust protection to ensure output wire and load

protection against short circuit or overload conditions.

The device features overcurrent protection which is

configurable via SPI in two ranges of thresholds.

This allows sufficient flexibility to support loads

that require large inrush currents, while providing

improved protection. Further, the device integrates

a programmable fuse profile (current versus time)

that turns off the switch under persistent overload

condition, thereby reducing the overhead on the MCU.

These two features together allow optimization of the

wire harness for any load profile with full protection.

The device supports a SPI-configurable capacitive

charging mode for ECU loads in power distribution

switch applications. The device also includes a low

quiescent current ON-state that provides up to 800

mA of peak current while consuming about 10 μA of

current.

The TPS2HCS10-Q1 device also provides a high

accuracy digital current sense over SPI that allows for

improved load diagnostics. By reporting load current

and the channel output voltage and output FET

temperature to a system MCU, the device enables

diagnosis of switch and load failures.

The TPS2HCS10-Q1 is available in a HTSSOP

package which allows for reduced PCB footprint.