FEATURES

• For surface mounted applications in order to optimize board space.

• Low profile package

• Built-in strain relief

• Glass passivated junction

• Low inductance

• Typical IR less than 5.0µA above 11V

• Plastic package has Underwriters Laboratory Flammability Classification 94V-O

• High temperature soldering : 260°C /10 seconds at terminals

• In compliance with EU RoHS 2002/95/EC directives