Features

Designed to maximize heat sink performance and improve component reliability

Displaces entrapped air between power-dissipating electronic components

Bond Line Thickness (BLT) of 0.0254mm

Practically no thermal contact resistance due to a very small thermal resistance path

Solid at room temperature for ease of application

Consistently and cleanly applied as dry pads to a heat sink or component surface

Resistant to dry out and pump out

Applications

Dissipation of heat in electronic devices is a critical and ever growing need as circuit

board power densities continue to rise. To address this need, this product can be

easily and cleanly applied in a wide variety of electronics thermal interface material

requirements where the heatsink is being attached with hardware. With a very thin

bondline of down to 0.0254mm, it is able to reduce the overall thermal resistance

from the component to the heatsink. This keeps the components cooler which allows

the electrical device to perform better. TGPK27P is not be used as an electrically

insulative product.