Features

• Thermal Conductivity 1.1 W/mK

• Flexible

• Convenient volume mix ratio

• Very low mixed viscosity

• Good adhesion to a wide variety of substrates

including metals, composites, glass, ceramics,

and many plastics

• Excellent electrical insulating characteristics

• Extreme resistance to water and humidity (allows

for submersion where needed)

Applications

Electronic components - Electrical and electronic devices