Features

• Great thermal conductivity

• Difficult to be deformed

• Easy to assemble

• One side low tack

Applications

Electronic components - Electric Vehicles, 5G, Autopilot System, Mobile

Phone, AIOT, HPC (High Performance Computing), Server, IC, CPU, MOS, LED,

Mother Board,Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device,

Wireless Hub, DDR ll Module, etc.

Best for low and medium power applications