Application:

Electronic Components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive,

Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy

Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power

Electronics, Robot, Servers, Smart Home, Telecom, etc.

Features

•Best for filling the gap

•High compressibility

•Low hardness

•Lower pressure to heated components or PCB