Features

• Thermal Conductivity 3.5 W/mK

• Easily dispensable from manual, semi-automatic

or fully automatic systems

• Full turn-key support from T-Global

• Low thermal impedance

• Low viscosity at room temperature

• Ultra-low compression forces

• High tack on most surfaces and reworkable

• Proven long term reliability

Applications

Consumer Electronics - Set-top boxes, IP routers, ECUs, Memory and Power

modules