KEY FEATURES

• Extended temperature. range -40…+85 °C

• Minimum product life requirement of 10 years

• 260 °C reflow Pin in Paste Soldering

• Plating thickness 0,76 µm [30 µinch] gold over

1,27 µm [50 µinch] nickel

• Improved EMI integrity and signal integrity performance

• Both current and voltage mode PHY-chips supported

BENEFITS

• The standardized RJ45 jack portfolio with integrated

magnetics with 1x1 straight and R / A, 1x2, 2x1 form factors

addresses many of the industrial applications

• Integrated magnetics reduces the (analog) design efforts

required by the customer

• Thicker gold plating (30 µinch over 50 µinch nickel) improves

corrosion resistance reducing equipment electrical problems

over lifetime

• TE’s products (260 °C reflow capable) fit industrial

assembly / solder processes without the need for an extra

assembly / solder step

• Extended temperature range addresses industrial equipment

requirements where standard temperature (0…70 °C) range

is too limited

• Offering standardized Tape & Reel or Tray packing for fully

automated or manual assembly process

APPLICATIONS

• All industrial applications requiring Ethernet

• All industrial equipment with RJ45 connectivity

• Industry Computers

• Hubs • PLC’s

• Routers • Switches

• Wireless access points • All Ethernet enabled equipment

ELECTRICAL

• 10 / 100 Base-T Ethernet, 1 Gbps

• Dielectric Withstanding Voltage: 2250 V DC

MECHANICAL

• -40…+85 °C; min. 750 mating cycles

MATERIALS

• Plating thickness 0,76 µm [30 µinch] gold over

1,27 µm [50 µinch] nickel

• UL 94 V-0

• 260 °C reflow capable

• High grade LCP (liquid crystal polymer material)

STANDARDS & SPECIFICATIONS

• IEC 60603-7-51 for 1 Gbps

• IEC 60603-7-5 for 10 / 100 Mbps

• Product Specification 108-94552

• Application Specification 114-94447

PRODUCT COMPLIANCE

• UL recognized

• RoHS compliant