FEATURES

• High resistance to mechanical stress and thermal shock by resin layers

• X8R and X8L type whose maximum temperature are up to 150°C are available

• C0G type having excellent stable temperature and DC-bias characteristics is also available

APPLICATIONS

• Fail-safe design for battery line

• Prevention of ceramic element crack by board bending

• Prevention of solder crack by thermal shock

• Equipment such as mobile devices and smart key having a high possibility of drop