FEATURES

• Glass passivated chip junction

• Available in uni-directional and bi-directional

• 400 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01

• Excellent clamping capability

• Very fast response time

• Low incremental surge resistance

• Solder dip 260 °C, 40 s

• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC