Features

• Glass passivated chip junction

• Integrally molded heatsink provides very low thermal

Resistance for Maximm heat dissipation

• Universal 3-way terminals; snap-on, wire wrap-around

Or P.C.B mounting

• Typical IR less than 0.3µA

• High forward surge current capability

• High temperature soldering guaranteed: 260˚C/10 seconds

at 5lbs.(2.3kg) tension

• This series is UL recognized under component index,

File number E194718

• RoHS Compliant