位置：TZ3261D > TZ3261D详情
TZ3261D中文资料
TZ3261D数据手册规格书PDF详情
Features:
Surface Mount Hermetic Package
Excellent Reliability Performance
Good Frequency Perturbation and Stability over temperature
Ultra Miniature Package
AEC-Q200 compliance
Moisture Sensitivity Level (MSL) : Level-1
Description and Applications:
Surface mount 2.0mmx1.6mm crystal unit for use in wireless communications devices,
especially for a need of ultra miniature package for mobility.
更新时间：2025-11-26 9:18:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TST |
23+ |
- |
5218 |
华南总代 |
|||
TST |
21+ |
DNA |
3000 |
公司现货,有挂就有货。 |
|||
TST |
23+ |
SMD |
56000 |
TST全系列在售,支持实单 |
|||
TST |
23+ |
SMD |
25000 |
专业配单,原装正品假一罚十,代理渠道价格优 |
|||
TST台湾嘉硕 |
2450+ |
9850 |
只做原厂原装正品现货或订货假一赔十! |
||||
24+ |
N/A |
46000 |
一级代理-主营优势-实惠价格-不悔选择 |
TZ3261D 资料下载更多...
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TAI-SAW相关芯片制造商
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