位置：TZ1166B > TZ1166B详情
TZ1166B中文资料
TZ1166B数据手册规格书PDF详情
Features:
Ceramic Seam Weld Package
Excellent Reliability Performance
Ultra Miniature Package
Available to Surface Mount Technology and IR Reflow Process
Description and Applications:
Surface mount 3.2mmx1.5mm crystal unit for use in communications devices,.
更新时间：2026-2-21 8:01:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TST |
21+ |
标准封装 |
27000 |
进口原装,优势专营品牌! |
|||
TST |
2026+ |
- |
5312 |
华南总代 |
|||
TST |
24+ |
15000 |
真实库存/绝无虚假/支持送货 |
||||
24+ |
N/A |
57000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
SYNOPTICS |
23+ |
QFP |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
|||
TST |
23+ |
SMD3225 |
50000 |
全新原装正品现货,支持订货 |
|||
TST |
23+ |
SMD |
25000 |
专业配单,原装正品假一罚十,代理渠道价格优 |
|||
TST |
24+ |
SMD3225 |
60000 |
||||
TWT |
24+ |
SMD |
7850 |
只做原装正品现货或订货假一赔十! |
|||
TST |
25+ |
SMD |
56000 |
TST全系列在售,支持实单 |
TZ1166B 资料下载更多...
TZ1166B 芯片相关型号
- 1407388
- 1412257
- 1412258
- 24-005063
- 2ED2744S01GXUMA1
- 68613014122
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- MWDL-31P-4K5-18M
- MWDL-31P-4K5-18M1
- MWDL-31P-4K5-18P
- MWDL-31P-4K5-18S
- SRF860CT
- STPST3H100
- STPST3H100AF
- STPST3H100UF
- TLV1852
- TLV1854
- TLV185X
- TZ1164A
TAI-SAW相关芯片制造商
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