位置:TZ0830A > TZ0830A详情
TZ0830A中文资料
TZ0830A数据手册规格书PDF详情
Features:
Ceramic Seam Weld Package
Excellent Reliability Performance
Ultra Miniature Package
Available to Surface Mount Technology and IR Reflow Process
Description and Applications:
Surface mount 3.2mmx2.5mm crystal unit for use in wireless communications devices,
especially for a need of ultra miniature package for mobility.
更新时间:2026-2-18 9:18:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TST |
2026+ |
- |
28000 |
华南总代 |
|||
TST |
21+ |
标准封装 |
6000 |
进口原装,订货渠道! |
|||
TST/嘉硕 |
24+ |
N/A |
60000 |
||||
TST |
24+ |
SMD |
9600 |
原装现货,优势供应,支持实单! |
TZ0830A 资料下载更多...
TZ0830A 芯片相关型号
- 111197G1
- 19104900
- BASH20MX2WT5G
- BASH21MX2WT5G
- BDY20
- MASTERGAN2
- MASTERGAN2TR
- RF4376-000
- RF4377-000
- RF4378-000
- SRL6012DPD2
- SRL6012DPS2
- SRL6012DSD2
- SRL6012DSS2
- SRL6012EPD2
- SRL6012EPS2
- SRL6012ESD2
- SRL6012ESS2
- TA1960AM
- TA1960BL1
- TA1960CM3
- TA1960FQ1
- TA1960JM
- TA1962AM
- TZ0832A
- TZ0834A
- TZ0835A
- TZ0836A
- TZ0837A
- TZ1361A
TAI-SAW相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
- P108
