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TZ0308C中文资料
TZ0308C数据手册规格书PDF详情
Features:
Surface Mount Hermetic Package
Excellent Reliability Performance
Good Frequency Perturbation and Stability over temperature
Ultra Miniature Package
Description and Applications:
Surface mount 3.2mmx2.5mm crystal unit for customer for use in wireless communications
devices, especially for a need of ultra miniature package for mobility.
更新时间：2026-8-17 15:41:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TST |
2026+ |
- |
38 |
华南总代 |
|||
JR |
26+ |
SMD |
5800 |
全新原装正品、可开增票、可溯源、一站式配单 |
TZ0308C 资料下载更多...
TZ0308C 芯片相关型号
- 1000220001
- 1524760000
- 712000012700
- FSCQ1565RTYDTU
- MM5Z4V3
- NS10145T2R2NNA
- PR02000302JA100
- PR02000302JA500
- PR02000302JAC00
- PR02000302JB100
- PR02000302JDC00
- PR02000302JK100
- PR02000302JR200
- PR02000302JR500
- S8-PH-3-B51-NN
- S8-PH-3-B51-PP
- S8-PH-3-M01-NN
- S8-PH-3-M01-PP
- S8-PH-5-B51-NN
- S8-PH-5-B51-PP
- S8-PH-5-M01-NN
- S8-PH-5-M01-PP
- S8-PH-5-M53-PP
- TZ0308B
- TZ0308E
- TZ0462B
- TZ0462C
- TZ0462D
- TZ0464C
- TZ0464D
TAI-SAW相关芯片制造商
Datasheet数据表PDF页码索引
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