采用焊接技术的 50 毫米晶闸管/晶闸管模块，耐压 1600 V

用于焊接技术中的50 mm PowerBLOCK 相位控制晶闸管 / 二极管模块。成本和性能经过优化可替代众所周知的高可靠性压力接触 技术。 • 焊料键合技术\n• 工业标准封装\n• 电气绝缘铜基板\n\n优势:\n• 利用我们的 IGBT 焊接和接合专业技术生产\n• 优化成本和性能\n• 一个供应各种 PowerBLOCK 模块的供应商;

Solder-Bond Technology

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采用焊接技术的 50 毫米晶闸管/晶闸管模块，耐压 1600 V

50 mm Eco Block 1600 V, 320 A thyristor/ thyristor module for phase control in solder bond technology. The cost optimized alternative to the well known highly reliable Power Block modules in pressure contact technology. \n Now these modules are also available with Thermal Interface Material (T • Solder-Bond Technology\n• Industrial standard package\n• Electrically insulated copper base plate\n\n优势:\n• Cost effective solution for higher competitiveness\n• Predictably high performance and lifetime due to 100% x-ray monitoring\n• Solid base plate for fast and easy mounting\n• One-stop-sh;

封装/外壳：模块 包装：托盘 描述：THYRISTOR MODULE 1600V 320A 分立半导体产品 晶闸管 - SCR - 模块

封装/外壳：模块 包装：散装 描述：LT-BOND MODULE 分立半导体产品 晶闸管 - SCR - 模块

Diode-Diode Modules

FEATURES * International standard package * Direct copper bonded Al2O3-ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ APPLICATIONS * Supplies for DC power equipment * DC supply for PWM inverter * Field supply for DC motors * Battery DC power supplies ADVANTAGES