TPIC8101 Knock Sensor Interface

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range – Device HBM Classification Level 3A – Device CDM Classification Level C6 • Dual-Channel Knock Sensor Interfa

振动和发动机爆震传感器接口

The TPIC8101 is a dual-channel signal processing IC for detection of premature detonation in combustion engine. The two sensor channels are selectable through the SPI bus. The knock sensor typically provides an electrical signal to the amplifier inputs. The sensed signal is processed through a progr • Qualified for Automotive Applications\n• Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range\n• Device CDM Classification Level C6\n• Dual-Channel Knock Sensor Interface\n• Serial Interface With Microprocessor (SPI)\n• Programmable Band-Pass Filter Center Frequency\n• 4;

KNOCK SENSOR INTERFACE

文件：324.74 Kbytes Page：20 Pages

KNOCK SENSOR INTERFACE

文件：242.27 Kbytes Page：18 Pages

TPIC8101 Knock Sensor Interface

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range – Device HBM Classification Level 3A – Device CDM Classification Level C6 • Dual-Channel Knock Sensor Interfa

TPIC8101 Knock Sensor Interface

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range – Device HBM Classification Level 3A – Device CDM Classification Level C6 • Dual-Channel Knock Sensor Interfa

TPIC8101 Knock Sensor Interface

1 Features 1• Qualified for Automotive Applications • AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range – Device HBM Classification Level 3A – Device CDM Classification Level C6 • Dual-Channel Knock Sensor Interfa

KNOCK SENSOR INTERFACE

文件：324.74 Kbytes Page：20 Pages

KNOCK SENSOR INTERFACE

文件：324.74 Kbytes Page：20 Pages

封装/外壳：20-SOIC（0.295"，7.50mm 宽） 包装：管件 描述：IC KNOCK SENSOR INTERFACE 20SOIC 集成电路（IC） 传感器和检测器接口

KNOCK SENSOR INTERFACE

文件：324.74 Kbytes Page：20 Pages

封装/外壳：20-SOIC（0.295"，7.50mm 宽） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC KNOCK SENSOR INTERFACE 20SOIC 集成电路（IC） 传感器和检测器接口

KNOCK SENSOR INTERFACE

文件：324.74 Kbytes Page：20 Pages

KNOCK SENSOR INTERFACE

文件：324.74 Kbytes Page：20 Pages

6-Pin DIP Optoisolators for Power Supply Applications(No Base Connection)

6-Pin DIP Optoisolators for Power Supply Applications(No Base Connection) The MOC8101, MOC8102, MOC8103, MOC8104 and MOC8105 devices consist of a gallium arsenide LED optically coupled to a silicon phototransistor in a dual–in–line package. • Closely Matched Current Transfer Ratio (CTR) Minimize

150 MHz SILICON QUADRATURE MODULATOR IC FOR DIGITAL MOBILE COMMUNICATIONS

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