型号 功能描述 生产厂家 企业 LOGO 操作
TI60F225C3L

DSTi60-v2.0

Features • High-density, low-power Quantum™ compute fabric • Built on TSMC 16 nm process • 10-kbit high-speed, embedded SRAM, configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, or ROM • High-performance DSP blocks for multiplication, addition, subtraction, accumulation

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未分类制造商

TI60F225C3L

封装/外壳:225-BGA 包装:托盘 描述:FPGA TITAN140HSIO 4PLL LP 225BGA 集成电路(IC) FPGA(现场可编程门阵列)

ETC

知名厂家

DSTi60-v2.0

Features • High-density, low-power Quantum™ compute fabric • Built on TSMC 16 nm process • 10-kbit high-speed, embedded SRAM, configurable as single-port RAM, simple dual-port RAM, true dual-port RAM, or ROM • High-performance DSP blocks for multiplication, addition, subtraction, accumulation

ETCList of Unclassifed Manufacturers

未分类制造商

更新时间:2026-1-5 19:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI
24+
QFN
20000
全新原厂原装,进口正品现货,正规渠道可含税!!
N/S
2450+
QFP
9850
只做原厂原装正品现货或订货假一赔十!
TI
22+
QFP-100
5000
只做原装鄙视假货15118075546
TI
20+
SOP-20P
2960
诚信交易大量库存现货
25+
32
公司优势库存 热卖中!!
ST
26+
CAN to-39
60000
只有原装 可配单
TI
24+
QFN
35200
一级代理/放心采购
TI
21+
SOP
10000
原装现货假一罚十
TL
05+
原厂原装
5001
只做全新原装真实现货供应
ANY
2764
全新原装 货期两周

TI60F225C3L数据表相关新闻