THVD24xxV ±70-V Fault-Protected 3 V to 5.5 V RS-485 Transceivers with Flexible I/O Supply and IEC ESD

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • 3-V to 5.5-V RS-485 supply voltage • Differential output exceeds 2.1 V for PROFIBUS compatibility with 5-V supply • 1.65 V to 5.5 V Supply for logic signal interface • SLR Pin Selectable Data Ra

THVD24xxV ±70-V Fault-Protected 3 V to 5.5 V RS-485 Transceivers with Flexible I/O Supply and IEC ESD

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • 3-V to 5.5-V RS-485 supply voltage • Differential output exceeds 2.1 V for PROFIBUS compatibility with 5-V supply • 1.65 V to 5.5 V Supply for logic signal interface • SLR Pin Selectable Data Ra

THVD24xxV ±70V Fault-Protected 3V to 5.5V RS-485 Transceivers with Flexible I/O Supply and IEC ESD

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • 3V to 5.5V RS-485 supply voltage • Differential output exceeds 2.1V for PROFIBUS compatibility with 5V supply • 1.65V to 5.5V Supply for logic signal interface • SLR Pin Selectable Data Rates:

THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

THVD24xxV-EP Enhanced 3V to 5.5V RS-485 Transceivers With 1.8V VIO Capability

1 Features • Meets or exceeds the requirements of the TIA/ EIA-485A and TIA/EIA-422B standards • Enhanced Product – Military temperature range (-55°C to 125°C) – One wafer fabrication site and one assembly and test site – Gold bond wire, NiPdAu lead finish – Wafer lot traceability – Exten

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