位置：首页 > IC中文资料第10387页 > TDA7406T
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
TDA7406T | CAR RADIO SIGNAL PROCESSOR DESCRIPTION The device includes a high performance audio processor with 7 bands equalizer and spectrum analyzer plus a stereo decoder-noiseblanker. The whole low frequency signal processing necessary for state-of the-art as well as future car radios is therefore provided. The digital control al | STMICROELECTRONICS 意法半导体 |   | |
TDA7406T | CAR RADIO SIGNAL PROCESSOR | STMICROELECTRONICS 意法半导体 | | |
封装/外壳：44-LQFP 功能：音频信号处理器 包装：托盘 描述：IC AUDIO SIGNAL PROCESSOR 44TQFP 集成电路（IC） 音频专用 | STMICROELECTRONICS 意法半导体 | | ||
Hex Inverting Buffers with High Voltage Open-Collector Outputs 文件：106.01 Kbytes Page：4 Pages | NSC 国半 | | ||
HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS 文件：140.94 Kbytes Page：7 Pages | TI 德州仪器 | | ||
HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS 文件：140.94 Kbytes Page：7 Pages | TI 德州仪器 | | ||
HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS 文件：140.94 Kbytes Page：7 Pages | TI 德州仪器 | | ||
HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS 文件：140.94 Kbytes Page：7 Pages | TI 德州仪器 | |
TDA7406T产品属性
- 类型
描述
- 型号
TDA7406T
- 制造商
STMICROELECTRONICS
- 制造商全称
STMicroelectronics
- 功能描述
CAR RADIO SIGNAL PROCESSOR
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ST(意法半导体) |
25+ |
N/A |
11543 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
STM |
2138+ |
QFP44 |
8960 |
专营BGA,QFP原装现货,假一赔十 |
|||
ST |
25+ |
ST-2017 |
20000 |
原装 |
|||
ST/意法 |
23+ |
QFP |
98900 |
原厂原装正品现货!! |
|||
STMicroelectronics |
18+ |
ICPROCESSORCARSIGNAL44-T |
6800 |
公司原装现货 |
|||
ST/意法 |
25+ |
QFP |
18000 |
原装正品,全新来谈 |
|||
ST |
25+ |
QFP-44 |
2987 |
只售原装自家现货!诚信经营!欢迎来电! |
|||
ST |
23+ |
ST-2017 |
16900 |
正规渠道,只有原装! |
|||
ST |
26+ |
ST-2017 |
60000 |
只有原装 可配单 |
|||
ST |
22+ |
44TQFP |
9000 |
原厂渠道,现货配单 |
TDA7406T规格书下载地址
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主要参数： 集成电路（IC） 音频专用 汽车级，AEC-Q100 功能 ：音频信号处理器 应用 ：车载音频 通道数： 4 接口： I2C 电压 - 电源： 8V ~ 10V 工作温度： -40°C ~ 85°C（TA） 安装类型： 表面贴装型 封装：28-SOIC（0.295，7.50mm 宽）
2020-3-6
DdatasheetPDF页码索引
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