Power Chip Resistors Thick Film on Alumina Substrate

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High Power Density

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Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

Power Chip Thick Film on Alumina Substrate

Power Chip® Thick Film on Alumina Substrate Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50 less board space than other radial packages. Convection cooling is maxi

107/207, 108/208 In-Line Diaphragm Seals

FEATURES „ 316L Stainless steel top housing (standard) „ Available with diaphragm welded or bonded to top housing or removable threaded capsule diaphragms „ Flow through design reduces the possibility of clogging „ Large 21/2˝ diaphragm compatible with most Ashcroft instrumentation

15.6 Ultra-Slim, All-in-One POS

Features ƒ 15.6 Full HD LCD (LED backlight) with P-CAP touch control ƒ Ultra-thin design with narrow bezel (11 mm/0.43 in) ƒ 11th generation Intel® Celeron®/Core™ i processor ƒ Anodized aluminum rear cover ƒ IP65-rated front panel for water and dust resistance ƒ Low-power, fanless operation

Direct replacement for T1 쩐 Wedge Base F9

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M12-A Male 5 Pin Field Attachable

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BLANK KEYSTONE SNAP-IN INSERT, UL

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