H.100/H.110 Interface and Time-Slot Interchangers

Introduction This advisory describes a flaw in some devices that the initial factory test program did not detect. The flaw exists in some version 2 and version 3 T8100A, T8102, and T8105 devices in both the SQFP and BGA package types. An enhanced factory test program has been in place since Janua

6-Pin DIP Optoisolators for Power Supply Applications(No Base Connection)

6-Pin DIP Optoisolators for Power Supply Applications(No Base Connection) The MOC8101, MOC8102, MOC8103, MOC8104 and MOC8105 devices consist of a gallium arsenide LED optically coupled to a silicon phototransistor in a dual–in–line package. • Closely Matched Current Transfer Ratio (CTR) Minimize

6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION)

6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS(NO BASE CONNECTION) FEATURES The MOC810X and CNY17F-X devices consist of a gallium arsenide LED optically coupled to a silicon phototransistor in a dual-in ine package. • Closely Matched Current Transfer Ratio (CTR) Minimizes Unit-to-Unit Var

SUPER BRIGHT T-1쩐 (5mm) LED LAMPS

DESCRIPTION These T-1¾ super bright LEDs have a narrow 20° viewing angle for concentrated light output. FEATURES ■ Outstanding meterial efficiency ■ Popular T-1¾ package ■ Low drive current ■ Solid state reliability ■ Super high brightness suitable for outdoors applications ■ Standard 1 mi

RF AMPLIFIER IC FOR 150 MHz TO 330 MHz PAGER SYSTEM

DESCRIPTION µPC8102T is a silicon monolisic integrated circuit designed as RF amplifier for 150 MHz to 330 MHz pager system. Due to 1 V supply voltage, this IC is suitable for low voltage pager system. The package is a 6 pin mini mold suitable for high-density surface mounting. This IC is manufa

RF AMPLIFIER IC FOR 150 MHz TO 330 MHz PAGER SYSTEM

DESCRIPTION µPC8102T is a silicon monolisic integrated circuit designed as RF amplifier for 150 MHz to 330 MHz pager system. Due to 1 V supply voltage, this IC is suitable for low voltage pager system. The package is a 6 pin mini mold suitable for high-density surface mounting. This IC is manufa