Features

For surface mounted applications in order to optimize board space

Low profile package

Glass passivated junction

Low inductance

Excellent clamping capability

400W peak pulse power capability at 10/1000μs waveform,

repetition rate (duty cycle): 0.01%

Fast response time

Typical IR less than 1μA above 10V

High Temperature soldering: 260℃/10 seconds at terminals

Plastic package has underwriters laboratory flammability 94V-0

Meets MSL level 1, per J-STD-020

IEC61000-4-2 ESD 30KV Air, 30KV contact compliance