eatures

For surface mounted applications in order to optimize board space

Low profile package

Built in strain relief

Gla ss p assivated j unction

Low inductance

Excellent clamping capability

600W peak pulse power capability at 10/1000 μ s waveform, r epetition r ate (duty cycle): 0.01%

Fast response time

Typical IR less than 1 μ A above 12V

High Temperature soldering: 26 0 ℃℃/10 seconds at terminals

Plastic package has underwriters laboratory flammability 94V 0

Meets MSL level 1, per J STD 020

IEC61000 4 2 ESD 30KV Air, 30KV contact compliance