Features

■ For surface mounted applications in order to optimize board space

■ Low profile package

■ Glass passivated junction

■ Low inductance

■ Excellent clamping capability

■ 400W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01%

■ Fast response time

■ Typical IR less than 1μA above 10V

■ High Temperature soldering: 260℃/10 seconds at terminals

■ Plastic package has underwriters laboratory flammability 94V-0

■ Meets MSL level 1, per J-STD-020

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IEC61000-4-2 ESD 30KV Air, 30KV contact compliance