Features

■For surface mounted applications in order to optimize board space

■Low profile package

■Built in strain relief

■Glass p assivated j unction

■Low inductance

■Excellent clamping capability

■150 0W peak pulse power capability at 10/1000 μ s waveform, r epetition r ate (duty cycle): 0.01%

■Fast response time

■Typical IR less than 1μA above 12V

■High Temperature soldering: 260 ℃℃/10 seconds at terminals

■Plastic package has underwriters laboratory flammability 94V 0

■Meets MSL level 1, per J STD 020

■Saf ety certification: UL: E244458

■IEC61000 4 2 ESD 30KV Air, 30KV contact compliance

Applications

■I/O interface

■ AC/DC power supply

■Low frequency signal transmission line (RS232, RS4 85, etc.)