Key Applications

Virtualization, Enterprise Server, Data Center Optimized, Application and data

serving, Model analysis, Compute Intensive Applications,

Key Features

Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors CPU

TDP supports Up to 270W TDP 3 UPI up to 11.2 GT/s;

Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM,

DDR4-3200MHz - Up to 4TB Intel® Optane™ Persistent Memory 200 Series,

DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved

for Intel® Optane Persistent Memory 200 Series only);

4 PCIe 4.0 x16 Low Profile (LP) 2 PCIe 4.0 x8 Low Profile (LP);

Dual Gigabit LAN with Intel® i350 Ethernet Controller;

1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240

Vdc;

1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2

front USB 2.0 and 4 rear USB 3.0);