Key Applications

Software-defined Storage, In-Memory Computing, Data Intensive HPC, Private

& Hybrid Cloud, NVMe Over Fabrics Solution,

Key Features

Dual Socket E (LGA-4677) 5th Generation Intel® Xeon® Scalable processors.

Up to 270W TDP.;

Supports 32 DIMMs with 2DPC, up to 8TB memory capacity with 32 DIMMs of

256GB 3DS RDIMM DDR5-4800 ECC memory;

Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant);

8x hot-swap E3.S (1T) NVMe drive bays, 4x E3.S(2T) CXL bays;

Redundant Titanium 1600W Power Supplies;