Key Applications

Virtualization, Enterprise Server, Data Center Optimized, Application and data

serving, Model analysis, Compute Intensive Applications,

Key Features

Dual AMD EPYC™ 7003/7002 Series Processors Supports Up to 240W CPU

TDP;

AMD® SP3;

Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM,

DDR4-3200MHz in 16 DIMMS;

3 PCIe 4.0 x16 Low Profile (LP) 3 PCIe 4.0 x8 Low Profile (LP);

Dual Gigabit LAN;

12 Hot-swap 3.5 (tool-less) or 2.5 (screw) drive bays (default configuration

is 8 SATA + 4 NVMe) (up to 12 NVMe drives supported with optional NVMe kit)

1 M.2 support: - M.2 Interface: PCIe 3.0 x4 - M.2 form factor: 2260, 2280,

22110 - M.2 Key: M-Key;

920W Redundant Power Supplies Platinum level;

1 rear VGA, 1 Type A port, 1 COM Port, and 4 USB ports;