位置:VB56G4A > VB56G4A详情
VB56G4A中文资料
VB56G4A数据手册规格书PDF详情
Features
Automotive compliancy
• AEC-Q100 grade 2 ongoing
• Operating junction temperature: -40°C to 125°C
Ultra compact 1.5 megapixel image sensor
• Global shutter architecture, 3D stacked sensor 40 nm/65 nm
• 2.61 μm x 2.61 μm BSI (backside illuminated) pixel
• 1.5 megapixel monochrome sensor (1124 x 1364)
• Package: OBGA
– Size: 6.2 mm x 6.9 mm
– Matrix: 6 x 8 balls
– Ball pitch: 0.8 mm
Easy integration
• Embedded auto-exposure
• Programmable sequences of 4-frame contexts
• 8 programmable GPIOs
– NIR (near infrared) illumination control outputs, synchronized with sensor
integration periods
– PWM (pulse-width modulation) control
– Master/Slave external frame start
• Automatic dark calibration
• Dynamic pixel-defective correction
• Image cropping
• Mirror/flip readout
• Binning and subsampling (x2 and x4)
• Typical power consumption 145 mW at 60 fps
• Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane
Unique image performance
• Peak quantum efficiency 24 @ 940 nm
• Linear dynamic range up to 60 dB
• Up to 88 frames per second at full resolution
Description
The VB56G4A is a 1.5 megapixel global shutter image sensor designed for
automotive driver monitoring applications.
Using pre-eminent 3D stacking and ST patented processes, the sensor performs
outstandingly in the near infrared region (940 nm). More precisely, thanks to backside
illumination technology and its excellent sensitivity, the VB56G4A can be operated
with one simple LED or VCSEL.
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
STMicroelectronics |
2026+ |
N/A |
6058 |
芯为深圳仓现货 |
|||
STMicroelectronics |
25+ |
10 |
加QQ:78517935原装正品有单必成 |
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VB56G4A 芯片相关型号
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STMICROELECTRONICS相关芯片制造商
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