Features

Automotive compliancy

• AEC-Q100 grade 2 ongoing

• Operating junction temperature: -40°C to 125°C

• ISO26262 compliant to support ASIL B system integration

• Cyber security features

Hybrid 5.1 MP global and rolling shutter features

• 3D stacked sensor 40 nm/65 nm

• 5.1 MP sensor (2560 x 1984)

• 2.25 μm x 2.25 μm BSI (backside illuminated) pixel

• RGB/NIR pixel technology with RGB NIR 4x4 pattern

• Image array size: 5.8 mm x 4.5 mm

• Optical format 1/2.5 inch

• Bare die or OBGA package

Innovative features

• Dual exposure controls (RGB and IR)

• On-chip bayerization ISP (image signal processor)

• On-chip color HDR (high dynamic range) merges

• On-chip NIR smart upscale

• 4 programmable contexts, in a versatile sequence, with up to 32 elements

Interface

• Quad lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane (MIPI CSI-2

copyright© 2005-2010 MIPI alliance, inc. standard for camera serial interface

2 (CSI-2) version 1.0)

• 6 programmable GPIOs (general-purpose input/outputs) to control the LED

(light-emitting diode)

– Output synchronized with sensor integration periods

– PWM (pulse-width modulation) control

• Fast mode plus I²C control interface

Unique imaging performance

• Peak quantum efficiency 25 @ 940 nm

• HDR linear dynamic range up to 100 dB in rolling shutter mode

• Up to 60 frames per second at full resolution

• Ultralow noise