Features

• PPAP capable

• Ultrafast with soft recovery behaviour

• Operating Tj from -40 °C to +175 °C

• SMD with isolated top side cooling

• Low thermal resistance

• Backside in insulated ceramic

• Dice chips on direct bond copper (DBC) substrate

• ECOPACK2 compliant

• MSL: Level 3

• Insulation voltage UL1557 certified (file E81734): VRMS = 4 kV

• Die is AECQ-101 qualified

• AQG324 recommendation