Features

• Unique ID

• Authentication for:

– Consumables and accessories anticloning

– Connected objects secure connection and preattachment to clouds

(Azure, AWS, and others)

– Wireless chargers Qi 1.3 and Qi 2.0

– Matter devices

– Digital power supplies OCP M-CRPS

• Pairing and secure channel with host application processor

• Configurable secure storage

• Usage monitoring with secure counters

• Secure connection establishment with remote host including transport layer

security (TLS 1.2 and TLS 1.3) handshake

• Signature verification service (secure boot and firmware upgrade)

• Secure storage in host nonvolatile memory based on wrapping and

unwrapping of local host envelopes

• Data hashing

• Symmetric data encryption or decryption

• On-chip key pair generation

Cryptography and security features

• Advanced asymmetric cryptography

– 5 Elliptic curve crytpography (ECC), nonvolatile private key slots + 1

ephemeral ECC key slot

– Supported elliptic curves:

◦ NIST P-256 P-384, P-521

◦ Brainpool P-256 P-384, P-512

◦ Edwards 25519

◦ Curve25519

• Supported functionalities:

– Digital signature generation and verification (ECDSA and EdDSA)

– Diffie-Hellman shared secret establishment (ECDH)

• Advanced symmetric cryptography

– 16 slots of symmetric cryptography with AES-128/256 CCM*, ECB,

GCM, CMAC, and HKDF

• Pairing with host-applicative processor

– AES 128-bit or 256-bit

• Local wrap/unwrap envelop key

– 2 slots of keys with AES 128-bit or AES 256-bit

• Data hashing

– SHA-2 with SHA-256, SHA-384, SHA-512

– SHA-3 with SHA3-256, SHA3-384, SHA3-512

• Random number generator

– Random number generator with NIST SP 800-90B compliant entropy source

• Latest generation of highly secure MCUs

– Unique serial number on each die

– CC EAL5+ AVA_VAN.5, and ALC_DVS.2 Common Criteria certified

– Active shield

– Monitoring of environmental parameters

– Protection mechanism against fault injection

– Protection against side-channel attacks

Hardware characteristics

• 16 Kbytes of configurable nonvolatile memory

– 25 years of data retention at 25°C

– 500 000 erase/write cycle endurance at 25°C

• 2.7 V to 5.5 V continuous supply voltages

• Operating temperature: -40°C to +105°C

Communication protocol

• I²C - bus slave interface

– Up to 400 kbps transmission speed (Fast mode)

– 7-bit addressing

Packages

• ECOPACK-compliant SO8N 8-lead plastic small outline package and UFDFPN 8-lead ultrathin profile fine

pitch dual flat package.