Features

Includes ST state-of-the-art patented technology.

Core

• Arm® 32-bit Cortex®-M33 CPU with TrustZone®, MPU, DSP, and FPU

Bluetooth® LE

• LE 2M

• LE coded

• Direction finding

• LE power control

• Isochronous channels

• Extended advertising

• Periodic advertising

• LE secure connections

• LE audio

• Core specification v6.0

Memories

• 1-Mbyte flash memory with ECC, including 256 Kbytes with 100 kcycles

• 128-Kbyte SRAM, including 64 Kbytes with parity check

• 512-byte (32 rows) OTP

ART Accelerator

• 8-Kbyte instruction cache allowing 0-wait-state execution from flash memory

(frequency up to 100 MHz, 150 DMIPS)

Fully integrated BOM including 32 MHz and 32 kHz crystals

Integrated antenna with IPD for best-in-class and reliable antenna matching

• Optional external antenna configuration

Certifications: CE, FCC, ISED, MIC, RoHS, REACH

Planned certifications: KC, NCC, SRRC, ANATEL

Ultra-low-power platform

• 1.71 to 3.6 V power supply

• SMPS and ultra-low-power modes for battery longevity

• -40°C to 85°C temperature range

Supporting:

• Ultra-low-power 2.4 GHz RF transceiver supporting Bluetooth® LE, IEEE

802.15.4 supporting Thread, Matter for Border router, and Zigbee®

• Programmable output power up to +10 dBm with 1 dB steps

• Rx sensitivity: -96 dBm (Bluetooth® LE at 1 Mbit/s), -97.5 dBm (IEEE 802.15.4 at 250 Kbit/s)

• Up to 33 I/Os (most of them 5 V-tolerant) with interrupt capability

Security and cryptography

• Secure firmware installation (SFI)

• Advanced encryption standards (AES) accelerators

• Public key accelerator (PKA)

• Protection against differential power analysis (DPA)

• HASH hardware accelerator

• True random number generator (RNG)

• 96-bit UID

• CRC calculation unit

• Flash readout and hide protection (RDP and HDP)

• Tamper detection

• Root hardware unique key (RHUK)

Serial wire debug (SWD) and JTAG

Suitable for 2 layer PCB product design

All packages are ECOPACK2 compliant.