Features

• Multisensing wireless platform for vibration monitoring and ultrasound detection

• Built around STWIN.box core system board with processing, sensing,

connectivity, and expansion capabilities

• Ultra-low power Arm® Cortex®-M33 with FPU and TrustZone at 160 MHz, 2048

kBytes Flash memory (STM32U585AI)

• MicroSD card slot for standalone data logging applications

• On-board Bluetooth® low energy v5.0 wireless technology (BlueNRG-M2), Wi-Fi

(EMW3080) and NFC (ST25DV04K)

• Option to implement authentication and brand protection secure solution with

STSAFE-A110

• Wide range of industrial IoT sensors:

– Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration

sensor (IIS3DWB)

– 3D accelerometer + 3D gyro iNEMO inertial measurement unit

(ISM330DHCX) with Machine Learning Core

– High-performance ultra-low-power 3-axis accelerometer for industrial

applications (IIS2DLPC)

– Ultra-low power 3-axis magnetometer (IIS2MDC)

– High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with

Embedded Machine Learning Core (IIS2ICLX)

– Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in

full-mold package (ILPS22QS)

– Low-voltage, ultra low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature

sensor (STTS22H)

– Industrial grade digital MEMS microphone (IMP34DT05)

– Analog MEMS microphone with frequency response up to 80 kHz

(IMP23ABSU)

• Expandable via a 34-pin FPC connector

Description

The STWIN.box (STEVAL-STWINBX1) is a development kit and reference design

that simplifies prototyping and testing of advanced industrial sensing applications in

IoT contexts such as condition monitoring and predictive maintenance.

It is an evolution of the original STWIN kit (STEVAL-STWINKT1B) and features

a higher mechanical accuracy in the measurement of vibrations, an improved

robustness, an updated BoM to reflect the latest and best-in-class MCU and

industrial sensors, and an easy-to-use interface for external add-ons.

The STWIN.box kit consists of an STWIN.box core system, a 480mAh LiPo battery,

an adapter for the ST-LINK debugger, a plastic case, an adapter board for DIL 24

sensors and a flexible cable.

The many on-board industrial-grade sensors and the ultra-low power MCU enable

applications that feature: ultra-low power, 9 DoF motion sensing, wide-bandwidth

vibration analysis, audio and ultrasound acoustic inspection, very precise local

temperature, and environmental monitoring.