位置:STM32MP157F-DK2 > STM32MP157F-DK2详情

STM32MP157F-DK2中文资料

厂家型号

STM32MP157F-DK2

文件大小

5189.12Kbytes

页面数量

7

功能描述

Discovery kits with increased-frequency 800 MHz STM32MP157 MPUs

数据手册

原厂下载下载地址一下载地址二到原厂下载

生产厂商

STMICROELECTRONICS

STM32MP157F-DK2数据手册规格书PDF详情

Features

• Common features:

– STM32MP157 Arm®-based dual Cortex®‑A7 800 MHz 32 bits +

Cortex®‑M4 32 bits MPU in a TFBGA361 package

– ST PMIC STPMIC1

– 4-Gbit DDR3L, 16 bits, 533 MHz

– 1-Gbit/s Ethernet (RGMII) compliant with IEEE-802.3ab

– USB OTG HS

– Audio codec

– 4 user LEDs

– 2 user and reset push-buttons, 1 wake-up button

– 5 V / 3 A USB Type-C® power supply input (not provided)

– Board connectors:

◦ Ethernet RJ45

◦ 4 × USB Host Type-A

◦ USB Type-C® DRP

◦ MIPI DSI®

◦ HDMI®

◦ Stereo headset jack including analog microphone input

◦ microSD™ card

◦ GPIO expansion connector (Raspberry Pi® shield capability)

◦ ARDUINO® Uno V3 expansion connectors

– On-board ST-LINK/V2-1 debugger/programmer with USB reenumeration

capability: Virtual COM port and debug port

– STM32CubeMP1 and full mainline open-source Linux® STM32 MPU

OpenSTLinux Distribution (such as STM32MP1Starter) software and

examples

– Support of a wide choice of Integrated Development Environments

(IDEs) including IAR Embedded Workbench®, MDK-ARM, and

STM32CubeIDE

• Board-specific features:

– 4 TFT 480×800 pixels with LED backlight, MIPI DSI® interface, and

capacitive touch panel

– Wi‑Fi® 802.11b/g/n

– Bluetooth® Low Energy 4.1

更新时间:2025-10-18 10:18:00
供应商 型号 品牌 批号 封装 库存 备注 价格
STMicroelectronics
25+
原封装
33220
郑重承诺只做原装进口现货
ST
23+
开发板
1000
原装正品,假一罚十
ST/意法半导体
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
ST/意法半导体
25+
原厂封装
9999
ST/意法半导体
25+
原厂封装
10280