Features

Includes ST state-of-the-art patented

technology

Core

• 32-bit Arm® Cortex®-M7 core with doubleprecision

FPU and L1 cache: 16 Kbytes of data

and 16 Kbytes of instruction cache; frequency

up to 480 MHz, MPU, 1027 DMIPS/

2.14 DMIPS/MHz (Dhrystone 2.1), and DSP

instructions

Memories

• 2 Mbytes of Flash memory with read-whilewrite

support

• 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc.

64 Kbytes of ITCM RAM + 128 Kbytes of

DTCM RAM for time critical routines),

864 Kbytes of user SRAM, and 4 Kbytes of

SRAM in Backup domain

• Dual mode Quad-SPI memory interface

running up to 133 MHz

• Flexible external memory controller with up to

32-bit data bus: SRAM, PSRAM,

SDRAM/LPSDR SDRAM, NOR/NAND Flash

memory clocked up to 100 MHz in

Synchronous mode

• CRC calculation unit

Security

• ROP, PC-ROP, active tamper, secure firmware

upgrade support, Secure access mode

General-purpose input/outputs

• Up to 168 I/O ports with interrupt capability

Reset and power management

• 3 separate power domains which can be

independently clock-gated or switched off:

– D1: high-performance capabilities

– D2: communication peripherals and timers

– D3: reset/clock control/power management

• 1.62 to 3.6 V application supply and I/Os

• POR, PDR, PVD and BOR

• Dedicated USB power embedding a 3.3 V

internal regulator to supply the internal PHYs

• Embedded regulator (LDO) with configurable

scalable output to supply the digital circuitry

• Voltage scaling in Run and Stop mode (6

configurable ranges)

• Backup regulator (~0.9 V)

• Voltage reference for analog peripheral/VREF+

• Low-power modes: Sleep, Stop, Standby and

VBAT supporting battery charging

Low-power consumption

• VBAT battery operating mode with charging

capability

• CPU and domain power state monitoring pins

• 2.95 μA in Standby mode (Backup SRAM OFF,

RTC/LSE ON)

Clock management

• Internal oscillators: 64 MHz HSI, 48 MHz

HSI48, 4 MHz CSI, 32 kHz LSI

• External oscillators: 4-48 MHz HSE,

32.768 kHz LSE

• 3× PLLs (1 for the system clock, 2 for kernel

clocks) with Fractional mode

Interconnect matrix

• 3 bus matrices (1 AXI and 2 AHB)

• Bridges (5× AHB2-APB, 2× AXI2-AHB)

4 DMA controllers to unload the CPU

• 1× high-speed master direct memory access

controller (MDMA) with linked list support

• 2× dual-port DMAs with FIFO

• 1× basic DMA with request router capabilities

Up to 35 communication peripherals

• 4× I2Cs FM+ interfaces (SMBus/PMBus)

• 4× USARTs/4x UARTs (ISO7816 interface,

LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART

• 6× SPIs, 3 with muxed duplex I2S audio class

accuracy via internal audio PLL or external

clock, 1x I2S in LP domain (up to 150 MHz)

• 4x SAIs (serial audio interface)

• SPDIFRX interface

• SWPMI single-wire protocol master I/F

• MDIO Slave interface

• 2× SD/SDIO/MMC interfaces (up to 125 MHz)

• 2× CAN controllers: 2 with CAN FD, 1 with

time-triggered CAN (TT-CAN)

• 2× USB OTG interfaces (1FS, 1HS/FS) crystalless

solution with LPM and BCD

• Ethernet MAC interface with DMA controller

• HDMI-CEC

• 8- to 14-bit camera interface (up to 80 MHz)

11 analog peripherals

• 3× ADCs with 16-bit max. resolution (up to 36

channels, up to 3.6 MSPS)

• 1× temperature sensor

• 2× 12-bit D/A converters (1 MHz)

• 2× ultra-low-power comparators

• 2× operational amplifiers (7.3 MHz bandwidth)

• 1× digital filters for sigma delta modulator

(DFSDM) with 8 channels/4 filters

Graphics

• LCD-TFT controller up to XGA resolution

• Chrom-ART graphical hardware Accelerator

(DMA2D) to reduce CPU load

• Hardware JPEG Codec

Up to 22 timers and watchdogs

• 1× high-resolution timer (2.1 ns max

resolution)

• 2× 32-bit timers with up to 4 IC/OC/PWM or

pulse counter and quadrature (incremental)

encoder input (up to 240 MHz)

• 2× 16-bit advanced motor control timers (up to

240 MHz)

• 10× 16-bit general-purpose timers (up to

240 MHz)

• 5× 16-bit low-power timers (up to 240 MHz)

• 2× watchdogs (independent and window)

• 1× SysTick timer

• RTC with sub-second accuracy and hardware

calendar

Cryptographic acceleration

• AES 128, 192, 256, TDES,

• HASH (MD5, SHA-1, SHA-2), HMAC

• True random number generators

Debug mode

• SWD & JTAG interfaces

• 4-Kbyte Embedded Trace Buffer

Description

STM32H753xI devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 480 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H753xI devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H753xI devices incorporate high-speed embedded memories with a dual-bank Flash memory of 2 Mbytes, up to 1 Mbyte of RAM (including 192 Kbytes of TCM RAM, up to 864 Kbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.

All the devices offer three ADCs, two DACs, two ultra-low power comparators, a low-power RTC, a high-resolution timer, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

• Standard peripherals

– Four I2Cs

– Four USARTs, four UARTs and one LPUART

– Six SPIs, three I2Ss in Half-duplex mode. To achieve audio class accuracy, the

I2S peripherals can be clocked by a dedicated internal audio PLL or by an external

clock to allow synchronization.

– Four SAI serial audio interfaces

– One SPDIFRX interface

– One SWPMI (Single Wire Protocol Master Interface)

– Management Data Input/Output (MDIO) slaves

– Two SDMMC interfaces

– A USB OTG full-speed and a USB OTG high-speed interface with full-speed

capability (with the ULPI)

– One FDCAN plus one TT-FDCAN interface

– An Ethernet interface

– Chrom-ART Accelerator

– HDMI-CEC

• Advanced peripherals including

– A flexible memory control (FMC) interface

– A Quad-SPI Flash memory interface

– A camera interface for CMOS sensors

– An LCD-TFT display controller

– A JPEG hardware compressor/decompressor

Refer to Table 2: STM32H753xI features and peripheral counts for the list of peripherals available on each part number.

STM32H753xI devices operate in the –40 to +85 °C temperature range from a 1.62 to 3.6 V power supply. The supply voltage can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2: Power supply supervisor) and connecting the PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled.

Dedicated supply inputs for USB (OTG_FS and OTG_HS) are available on all packages except LQFP100 to allow a greater power supply choice.

A comprehensive set of power-saving modes allows the design of low-power applications.

STM32H753xI devices are offered in 8 packages ranging from 100 pins to 240 pins/balls. The set of included peripherals changes with the device chosen.

These features make STM32H753xI microcontrollers suitable for a wide range of applications:

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances

• Mobile applications, Internet of Things

• Wearable devices: smart watches.

Figure 1 shows the device block diagram.