Features

• Dynamic Efficiency Line with BAM (Batch Acquisition Mode)

• Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

• Memories

– Up to 1 Mbyte of Flash memory

– 256 Kbyte of SRAM

– Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory

– Dual mode Quad-SPI interface

• LCD parallel interface, 8080/6800 modes

• Clock, reset and supply management

– 1.7 V to 3.6 V application supply and I/Os

– POR, PDR, PVD and BOR

– 4-to-26 MHz crystal oscillator

– Internal 16 MHz factory-trimmed RC

– 32 kHz oscillator for RTC with calibration

– Internal 32 kHz RC with calibration

• Power consumption

– Run: 112 μA/MHz (peripheral off)

– Stop (Flash in Stop mode, fast wakeup time): 50 μA Typ @ 25 °C; 75 μA max @25 °C

– Stop (Flash in Deep power down mode, slow wakeup time): down to 18 μA @ 25 °C; 40 μA max @25 °C

– Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V

– VBAT supply for RTC: 1 μA @25 °C

• 1×12-bit, 2.4 MSPS ADC: up to 16 channels

• 2x digital filters for sigma delta modulator, 4x PDM interfaces, stereo microphone support

• General-purpose DMA: 16-stream DMA

• Up to 17 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer

• Debug mode

– Serial wire debug (SWD) & JTAG

– Cortex ® -M4 Embedded Trace Macrocell™

• Up to 114 I/O ports with interrupt capability

– Up to 109 fast I/Os up to 100 MHz

– Up to 114 five V-tolerant I/Os

• Up to 17 communication interfaces

– Up to 4x I2C interfaces (SMBus/PMBus)

– Up to 4 USARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)

– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces

– SDIO interface (SD/MMC/eMMC)

– Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY

– 2x CAN (2.0B Active)

• True random number generator

• CRC calculation unit

• 96-bit unique ID

• RTC: subsecond accuracy, hardware calendar

• All packages are ECOPACK®2

Description

STM32F412XE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412XE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.

STM32F412XE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of Flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.

They also feature standard and advanced communication interfaces:

• Up to four I2Cs, including one I2C supporting Fast-Mode Plus

• Five SPIs

• Five I2Ss of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL, or via an external clock to allow synchronization.

• Four USARTs

• An SDIO/MMC interface

• A USB 2.0 OTG full-speed interface

• Two CANs. In addition, STM32F412xE/G devices embed advanced peripherals:

• A flexible static memory controller interface (FSMC)

• A Quad-SPI memory interface

• A digital filter for sigma modulator (DFSDM), two filters, up to four inputs, and support of microphone MEMs.

STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.

The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.

These features make the STM32F412xE/G microcontrollers suitable for a wide range of applications:

• Motor drive and application control

• Medical equipment

• Industrial applications: PLC, inverters, circuit breakers

• Printers, and scanners

• Alarm systems, video intercom, and HVAC

• Home audio appliances

• Mobile phone sensor hub

• Wearable devices

• Connected objects

• Wifi modules