Features

■ Ultra low top and bottom junction to case

thermal resistance

■ Extremely low on-resistance RDS(on)

■ RDS(on)*Qg industry benchmark

■ High avalanche ruggedness

■ Fully encapsulated die

■ 100 Matte tin finish (in compliance with the

2002/95/EC european directive)

■ PolarPAK® is a trademark of VISHAY

Application

■ Switching applications

Description

This product utilizes the 5th generation of design

rules of ST’s proprietary STripFET™ technology.

The lowest available RDS(on)*Qg, in this chip scale

package, makes this device suitable for the most

demanding DC-DC converter applications, where

high power density is to be achieved.